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Posted on January 16, 2019February 20, 2019 by sarah

University of Maine

STS DRIE(deep reactive ion etch)March RIE(plasma etch)solvent bench(wet process)General use bench(wet process)Silicon Etch(wet process)RCA Clean bench(wet process)Piranha_nitrides bench(wet process)Photolithography bench(mask making)Mann pattern generator(mask making)Filmetrics thin film measurement( analysis char)JA Woolam ellipsometer(analysis char)Tencor Alphastep(analysis char)MPT RTP-600s Rapid thermal process furnaceAJA Sputter deposition(phys vac deposition)AJA Sputter deposition(phys vac deposition)Oxford OpAL ALD deposition(phys vac deposition)Oxide and anneal furnace(furnaces)adjusted logoSEM 4 (Z)SEM 2 (Z)SEM 1 (Z)Photolithography bench(mask making)Laurell PR spinner(photolithography)Karl Suss MA6 aligner(photolithography)table spin coater(photolithography)Solitec vapor prime_PR oven(photolithography)Dicing saw(packaging dicing)SCS Parylene coater(plama etch cvd)Oxford RIE(plasma etch cvd)Oxford PECVD(plasma etch cvd)Clean Room 6confocalSEMTEM PhillipsImage1Image12019-01-16_16-10-41

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